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originally published February 2000
The following areas are addressed in this Document:
SEMI E187-0122 (first published)
SEMI F62-0701 (Reapproved 1111)
This Test Method is especially applicable for silicon where boron is an unintentional p-type contaminant at trace levels (<5 × 1014 atoms/cm3)
PCB, Board Assembly and Its Soldering StdTpc-undefined originally published February 2000Course Description The semiconductor industry provides critical enabling technology for many products and fields and has been in periods of rapid growth. While electronics goods dominate the market, communications, medical devices and the automotive industry show signs of increased potential. The course provides foundational knowledge of PCBs, the board assembly process and soldering. This course is the second course of the IC Packaging curriculum for
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